| 摘要 |
Systems and methods for conductive pillars are provided. In one embodiment, a system comprises an electrical board comprising an electrical device, and a packaged die, the packaged die bonded to the electrical board. The packaged die comprises a substrate layer, the substrate layer comprising a recessed area, a conductive trace, wherein a portion of the conductive trace is formed in the recessed area, and an epitaxial device layer bonded to the substrate layer. The device layer comprises a MEMS device, and an epitaxial conductive pillar, wherein a first side of the epitaxial conductive pillar is electrically connected to the conductive trace and the second side of the epitaxial conductive pillar is electrically connected to the electrical board, wherein the epitaxial conductive pillar extends through the epitaxial device layer to electrically couple the conductive trace to an interface surface on the epitaxial device layer.
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