发明名称 |
Optical proximity sensor package with lead frame |
摘要 |
Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.
|
申请公布号 |
US8502151(B2) |
申请公布日期 |
2013.08.06 |
申请号 |
US20100697276 |
申请日期 |
2010.01.31 |
申请人 |
YAO YUFENG;HE JUNHUA;TAN WEE SIN;AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD. |
发明人 |
YAO YUFENG;HE JUNHUA;TAN WEE SIN |
分类号 |
G01J5/20;G01J5/02;H01L21/00;H01L27/146;H01L31/0203;H01L31/0232 |
主分类号 |
G01J5/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|