| 摘要 |
PROBLEM TO BE SOLVED: To reduce chipping particularly at a surface of a brittle material substrate when performing drilling processing by irradiating a laser beam on the brittle material substrate.SOLUTION: The method for laser processing is for performing drilling processing by irradiating a laser beam on a brittle material substrate, and includes a first step and a second step. In the first step, the laser beam irradiation starts from the front surface of the brittle material substrate, a light condensing position of the laser beam is moved from the back surface toward the front surface of the brittle material substrate, and drilling processing is performed from the back surface of the substrate to a position of a prescribed depth. In the second step, the laser beam is irradiated from the front surface of the brittle material substrate, the light condensing position of the laser beam is moved from the front surface toward the back surface of the brittle material substrate with respect to the hole formed in the first step, and drilling processing is performed for communicating the hole with the hole formed in the first step. |
