| 摘要 |
PROBLEM TO BE SOLVED: To mount an electronic component on a wiring board without causing inclinations thereby inhibiting the occurrence of connection failures between a terminal of the electronic component and a terminal pad of the wiring board.SOLUTION: A footprint 51 to which a bottom surface electrode of an electronic component is soldered is divided into small regions A1 to A4 by slits 51x, 51y formed in the footprint 51 and insulation patterns 53, 54 formed on the footprint 51. The structure prevents cream solder 55 applied to each small region A1 to A4 from moving beyond boundaries of the small regions A1 to A4 when a wiring board is heated in a reflow furnace. As a result, a thickness of the cream solder 55 applied between the footprint 51 formed on the wiring board and the bottom surface electrode of the electronic component is equalized and the electronic component is mounted on the wiring board without being inclined. |
