| 摘要 |
<p>A ceramic package base comprising a package substrate (1), a circuit layout layer printed on the package substrate and a package fixed layer arranged on the periphery of the package substrate and the circuit layout layer, wherein the circuit layout layer comprises at least one metal slurry (3) region. At least one compensation metal slurry region (4) which corresponds to the metal slurry region is further arranged in a blank region (2) which is not provided with metal slurry (3). To apply a metal slurry pattern onto the package substrate of the ceramic package, a compensation metal slurry region (4) which is uniformly and symmetrically distributed with the metal slurry region (3) is added on the package substrate, thereby enabling the shrinkage of the metal slurry (3) and ceramic (1) to be uniform during sintering, reducing the stress, further reducing the deformation possibility of the base after sintering, effectively improving the deformation situation of the base, providing reliable guarantee for follow-up mounting of a crystal element, further improving the finished product rate of a base product, greatly reducing the cost and improving the competitiveness of the product.</p> |
