HIGH-STRENGTH COPPER ALLOY PLATE EXCELLENT IN OXIDE FILM ADHESIVENESS

摘要

PURPOSE: A high-strength copper alloy plate with excellent oxide film adhesion is provided to obtain the excellent oxide film adhesion of a high level by restraining a peak area value of C1s with respect to a peak area value of Cu2p at 0.35 or less when observing the surface of the copper alloy plate with an XPS analysis method. CONSTITUTION: A high-strength copper alloy plate with excellent oxide film adhesion comprises 0.02-0.5wt% of Fe, 0.01-0.25wt% of P, and the rest of Fe and inevitable impurities. A mass ratio of Fe with respect to P is 2.0-5.0. An area rate of a fine crystal grain having a diameter less than 0.5μm An area rate of a fine crystal grain which diameter with respect to an observation area is less than 0.5μm when observing the surface of the copper alloy plate with an EBSD(Electron Backscatter Diffraction Analysis) method is 0.90 or less. A peak area value of C1s with respect to a peak area value of Cu2p at 0.35 or less when observing the surface of the copper alloy plate with an XPS analysis method.