| 摘要 |
<p>Disclosed is an epoxy-modified polyphenylene oxide resin. The epoxy-modified polyphenylene oxide resin has a structural unit as shown in formula (I), and which is produced by the following steps: adding polymerization reaction solvent to 100 parts of solid polyphenylene oxide resin for forming a liquid polyphenylene oxide resin solution, and then adding 5-60 parts of epoxy resin and 0.001-5 parts of a catalyst to the solution, stirring and mixing at the temperature of 80-140°C for 1-3 hours to obtain a prepolymerization solution. Further disclosed are a resin composition containing the epoxy-modified polyphenylene oxide resin and an application for preparing printed circuit board. The epoxy-modified polyphenylene oxide resin composition has excellent impregnation properties for glass fiber cloth, the preparation process of which is simple, highly efficient and environmentally friendly, and the product purity of which is highly controllable. The epoxy-modified polyphenylene oxide resin composition can be used for making a laminated material and a copper clad laminated plate, which has excellent heat resistance and dielectric properties and is in favor of signal transmission of high frequency circuit board.</p> |
