| 摘要 |
A lithography apparatus which positions a substrate based on measurement of a position of an alignment mark on the substrate to form a pattern on the substrate. The apparatus includes an acquisition unit configured to acquire a first required alignment precision in a first direction, and a second required alignment precision in a second direction different from the first direction, and a controller configured to determine, based on the first required alignment precision, a first condition for a first measurement process of measuring a position of an alignment mark in the first direction, to determine, based on the second required alignment precision, a second condition for a second measurement process of measuring a position of an alignment mark in the second direction.
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