ADHESIVE SHEET, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT USING ADHESIVE SHEET

摘要

Provided is an adhesive sheet which does not undergo the time deterioration in pick-up properties of a chip in a pick-up step and can be used in both of a production line in which a warming procedure is employed before dicing and a production line in which any warming procedure is not employed before dicing. The adhesive sheet comprises a base film comprising polyvinyl chloride or an ionomer resin and an adhesive agent layer arranged on the base film and comprising an adhesive agent composition, wherein the adhesive agent composition comprises 100 parts by mass of a (meth)acrylic acid ester copolymer and 0.1 to 7 parts by mass of an isocyanate-type curing agent, the (meth)acrylic acid ester copolymer comprises 35 to 85 mass% of a methyl (meth)acrylate unit, 10 to 60 mass% of a 2-ethylhexylacrylate unit, 0.5 to 10 mass% of a monomer unit having a carboxyl group and 0.01 to 5 mass% of a monomer unit having a hydroxyl group, and an epoxy-type curing agent is contained in the adhesive agent composition at content of 0 to 0.25 part by mass relative to 100 parts by mass of the (meth)acrylic acid ester copolymer component.