发明名称 |
BONDING ON SILICON SUBSTRATE HAVING A GROOVE |
摘要 |
<p>A method and apparatus for bonding on a silicon substrate are disclosed. An apparatus includes a membrane having a membrane surface, a groove in the membrane surface, a transducer having a transducer surface substantially parallel to the membrane surface, and an adhesive connecting the membrane surface to the transducer surface. The groove can be configured to permit flow of adhesive into and through the groove while minimizing voids or air gaps that could result from incomplete filling of the groove. Multiple grooves can be formed in the membrane surface and can be of uniform depth.</p> |
申请公布号 |
EP2332169(A4) |
申请公布日期 |
2013.05.29 |
申请号 |
EP20090815247 |
申请日期 |
2009.09.18 |
申请人 |
FUJIFILM DIMATIX, INC. |
发明人 |
MENZEL, CHRISTOPH;DEBRABANDER, GREGORY;NISTORICA, CORINA |
分类号 |
H01L21/60;H01L41/09;H01L41/22;H01L41/313 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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