Power semiconductor module with contact springs

摘要

The power semiconductor module has a housing (3), a substrate with a metallic conducting path, and a connecting element guided outward from a conducting path or a contact surface of power semiconductor element arranged on a conducting path. A contact unit of a contact spring (70) is formed as pin and a diameter (D) of a partial recess (34) is smaller than the sum of the diameter of the pin-shaped contact unit and the displacement determined by a deformation (720) of the contact unit. The deformation is arranged between another partial recess and the substrate.