| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing composite board, or the like by which an injection molded substrate and a printed circuit board are easily joined without requiring special tools or the amount of man-hour. <P>SOLUTION: A circuit conductor 13 is fixed to molds 19a, 19b being injection molding molds with pins or the like at prescribed positions. In such a case, the printed circuit board 5 is arranged at a prescribed position and a pat 15 of the printed circuit board 5 is brought into contact with a circuit conductor 13. In this condition, injection molding is carried out by injecting a resin 11 into a cavity formed by the molds 19a, 19b. When the resin 11 is injected into the molds 19a, 19b, the temperature of the circuit conductor 13 (plating layer 17) is raised by the injection temperature. When the injection temperature is higher than the melting temperature of the plating layer 17, the plating layer 17 is melted in the injection. The plating layer 17 is therefore melted in the contact part of the surface of the circuit conductor 13 with the pat 15 and after that, soldered when cooled. <P>COPYRIGHT: (C)2013,JPO&INPIT |
