MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

摘要

Provided is a manufacturing method for a semiconductor device that has a plurality of semiconductor components and a plurality of resin layers, the method comprising the following: a step in which resin layers and semiconductor components are alternately stacked on a substrate, and the same is adhered by being subjected to heating and pressurization at a temperature less than the temperature at which the substrate and/or a solder layer of the semiconductor components melts; and a step in which heat and pressure are applied at a temperature at which the solder layer melts or a greater temperature.