TEMPORARY ADHESIVE COMPOSITION, AND METHOD FOR MANUFACTURING THIN WAFER USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a temporary adhesive composition that is superior in thermal stability while maintaining solvent resistance, and to provide a method for manufacturing a thin wafer using the same.

SOLUTION: The temporary adhesive composition includes: (A) non-aromatic saturated hydrocarbon group-containing organopolysiloxane; (B) an antioxidant; and (C) an organic solvent, wherein the component (A) is 100 parts by mass, the component (B) is 0.5 to 5 parts by mass, and the component (C) is 10 to 1000 parts by mass.

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