发明名称 A HIGH EFFICIENCY SUPTTEING APPARTUS
摘要 PURPOSE: A high efficiency sputtering apparatus is provided to prevent the corrosion of a magnet with a cover in order to make the intensity and distribution of a magnetic field uniform, thereby improving deposition efficiency with preventing the property variation of a deposited thin film. CONSTITUTION: A high efficiency sputtering apparatus includes a housing(210), a hollow cylinder type sputtering target(220), and a magnet unit(230). The housing at a cathode electrode inside a vacuum chamber is rotated by a power source. The magnet unit comprises a backing plate(233), a magnet(232), and a cover(231). The magnet unit is installed at the periphery of a coolant feeding pipe at the inner center of the housing. The magnet is coupled to one side of the backing plate, and the cover covers the outer surface of the magnet. The sputtering target is formed to have a distance from the magnet unit. [Reference numerals] (AA) Discharge of cooling water; (BB) Intake of cooling water
申请公布号 KR20130047302(A) 申请公布日期 2013.05.08
申请号 KR20110112238 申请日期 2011.10.31
申请人 KOREA INSTITUTE OF MACHINERY & MATERIALS 发明人 LEE, DONG GEUN;LEE, YONG TAI;KIM, TAE WON;HA, HEON CHO
分类号 C23C14/35 主分类号 C23C14/35
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