发明名称 |
A HIGH EFFICIENCY SUPTTEING APPARTUS |
摘要 |
PURPOSE: A high efficiency sputtering apparatus is provided to prevent the corrosion of a magnet with a cover in order to make the intensity and distribution of a magnetic field uniform, thereby improving deposition efficiency with preventing the property variation of a deposited thin film. CONSTITUTION: A high efficiency sputtering apparatus includes a housing(210), a hollow cylinder type sputtering target(220), and a magnet unit(230). The housing at a cathode electrode inside a vacuum chamber is rotated by a power source. The magnet unit comprises a backing plate(233), a magnet(232), and a cover(231). The magnet unit is installed at the periphery of a coolant feeding pipe at the inner center of the housing. The magnet is coupled to one side of the backing plate, and the cover covers the outer surface of the magnet. The sputtering target is formed to have a distance from the magnet unit. [Reference numerals] (AA) Discharge of cooling water; (BB) Intake of cooling water
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申请公布号 |
KR20130047302(A) |
申请公布日期 |
2013.05.08 |
申请号 |
KR20110112238 |
申请日期 |
2011.10.31 |
申请人 |
KOREA INSTITUTE OF MACHINERY & MATERIALS |
发明人 |
LEE, DONG GEUN;LEE, YONG TAI;KIM, TAE WON;HA, HEON CHO |
分类号 |
C23C14/35 |
主分类号 |
C23C14/35 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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