PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD

摘要

A PHOTOSENSITIVE RESIN COMPOSITION ACCORDING TO THE INVENTION COMPRISES (A) A BINDER POLYMER, (B) A PHOTOPOLYMERIZING COMPOUND WITH AN ETHYLENIC UNSATURATED GROUP AND (C) A PHOTOPOLYMERIZATION INITIATOR, WHEREIN COMPONENT (B) CONTAINS A COMPOUND REPRESENTED BY THE FOLLOWING GENERAL FORMULA (I). [CHEMICAL FORMULA 1] [WHEREIN R1-R3 EACH INDEPENDENTLY REPRESENT A GROUP REPRESENTED BY THE FOLLOWING GENERAL FORMULA (II): [CHEMICAL FORMULA 2] OR THE FOLLOWING GENERAL FORMULA (III): [CHEMICAL FORMULA 3] AND AT LEAST ONE OF R1-R3 IS A GROUP REPRESENTED BY GENERAL FORMULA (III).]