发明名称 |
Laminated semiconductor wafer, laminated chip package and method of manufacturing the same |
摘要 |
In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region.
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申请公布号 |
US8426947(B2) |
申请公布日期 |
2013.04.23 |
申请号 |
US20100848569 |
申请日期 |
2010.08.02 |
申请人 |
SASAKI YOSHITAKA;ITO HIROYUKI;IIJIMA ATSUSHI;HEADWAY TECHNOLOGIES, INC.;SAE MAGENTICS (H.K.) LTD. |
发明人 |
SASAKI YOSHITAKA;ITO HIROYUKI;IIJIMA ATSUSHI |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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