| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of relaxing the stress applied from a mold resin to a semiconductor chip. <P>SOLUTION: A semiconductor device is sealed by a mold resin. The semiconductor device includes a semiconductor chip 1 and a base 2 on which the semiconductor chip 1 is mounted, and stress relaxation members 3, which relax the stress applied from the mold resin to the semiconductor chip 1, are disposed outside corners of the semiconductor chip 1 on the base 2. <P>COPYRIGHT: (C)2013,JPO&INPIT |
