| 摘要 |
<p>PURPOSE: An epoxy resin composition for sealing semiconductors is provided to suppress the bending of a package, to reduce temperature dependability to bending, and to have excellent mobility, continuous moldability, and powder blocking. CONSTITUTION: An epoxy resin composition for sealing semiconductors contains an epoxy resin, a phenol resin, an inorganic filler, a compound indicated in chemical formula 1, and a releasing agent. The containing amount of the epoxy resin composition is 0.1-1.5 wt%. The releasing agent contains a linear saturated carboxylic acid with a number average molecular weight of 550-800 and/or oxidized polyethylene wax. In chemical formula 1, R1 is a hydroxyl group or alkoxy group, R2 is hydrogen or a monovalent hydrocarbon group, and n is an integer from 1-7.</p> |
