| 摘要 |
The present disclosure relates to a process for preparation of a polymer composition comprising: blending an epoxy resist, preferably SU-8, and at least one compound of formula (I) to obtain a reaction mixture; and curing the reaction mixture to obtain the polymer composition. The present disclosure also relates to a polymer composition comprising a reaction product of an epoxy resist, preferably SU-8, and at least one compound of formula (I). The present disclosure further relates to a process for manufacturing a device comprising: fabricating a device with polymer composition comprising a reaction product of an epoxy resist, preferably SU-8; and at least one compound of formula (I) to obtain the fabricated device. The present disclosure also relates to a device comprising: a polymer composition comprising a reaction product of an epoxy resist, preferably SU-8; and at least one compound of formula (I). |
