| 摘要 |
PURPOSE: A wafer polishing apparatus is provided to improve the satisfaction of a client by using a polishing pad according to the quality property of a wafer edge. CONSTITUTION: A carrier mounts a wafer and is arranged between a first polishing pad(115) and a second polishing pad(125). The first polishing pad and the second polishing pad are classified into a first region, a second region, and a third region. The third region is located between the first region and the second region. At least one groove is formed on the first region and the second region. |
