发明名称 FORMED CAPACITOR-EMBEDDED MULTILAYER PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board capable of performing a stable operation without increasing the number and region of noise suppression capacitors even when a mounted IC performs a high speed operation to generate noise itself. <P>SOLUTION: A formed capacitor-embedded multilayer printed wiring board includes: a component mounting surface on which a plurality of conductive layers and insulating layers are alternately stacked and a plurality of electronic components including at least one active component are mounted; a power supply pattern layer; a ground pattern layer; and a capacitor including a dielectric sandwiched by an anode electrode and a cathode electrode facing each other, the dielectric being arranged between layers of the power supply pattern layer and the ground pattern layer. In the formed capacitor-embedded multilayer printed wiring board, the active component is disposed on the power supply layer, and is electrically connected to a power supply pattern connected to the anode electrode. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013030528(A) 申请公布日期 2013.02.07
申请号 JP20110163961 申请日期 2011.07.27
申请人 CMK CORP 发明人 SAITO JUNICHI;HOSOYA TAKESHI
分类号 H05K3/46;H01L23/12;H01L25/04;H01L25/18 主分类号 H05K3/46
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