MEMORY MODULE IN A PACKAGE

摘要

A microelectronic package (10) can include a substrate (20) having first and second opposed surfaces (21, 22), first, second, third, and fourth microelectronic elements (30a, 30b, 30c, 30d), and terminals (25) exposed at the second surface. Each microelectronic element (30) can have a front surface (31) facing the first surface (21) of the substrate (20) and a plurality of contacts (35) at the front surface. The front surfaces (31) of the microelectronic elements (30) can be arranged in a single plane parallel to and overlying the first surface (21). Each microelectronic element (30) can have a column of contacts (35) exposed at the front surface and arranged along respective first, second, third, and fourth axes (29a, 29b, 29c, 29d). The first and third axes (29a, 29c) can be parallel to one another. The second and fourth axes (29b, 29d) can be transverse to the first and third axes (29a, 29c).