SOLID-STATE IMAGE PICKUP DEVICE, MANUFACTURING METHOD OF THE SAME AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a back side illumination solid-state image pickup device in which a high concentration impurity region is formed in a semiconductor substrate on a rear face side.

SOLUTION: A solid-state image pickup device comprises: a semiconductor substrate 17 in which a rear face side serves as a light incident surface and a surface side serves as a circuit formation surface; a connection part 23 serving as a connection part connected to a contact plug 31 transferring a signal charge generated on the semiconductor substrate on the rear face side to the inside the semiconductor substrate and having an impurity concentration distribution peak in vicinity of an interface of the semiconductor substrate on the rear face side; and one or more photoelectric conversion part formed in the semiconductor substrate.

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