发明名称 |
Structure with electronic component mounted therein and method for manufacturing such structure |
摘要 |
A structure with electronic component mounted therein includes a wiring board on which an electronic component is mounted at least on its first face, resin provided at least between the electronic component and the wiring board, and a plurality of holes formed in the wiring board at region corresponding to a mounting position of the electronic component. The holes are filled with the resin. This suppresses warpage of the structure with electronic component mounted therein, and also improves reliability by reducing a stress applied to a bonding section between the wiring board and the electronic component.
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申请公布号 |
US8345444(B2) |
申请公布日期 |
2013.01.01 |
申请号 |
US20080675080 |
申请日期 |
2008.10.21 |
申请人 |
PANASONIC CORPORATION;SAKATANI SHIGEAKI;MATSUNO KOSO;YAMAGUCHI ATSUSHI;MIYAKAWA HIDENORI;UEDA MIKIYA |
发明人 |
SAKATANI SHIGEAKI;MATSUNO KOSO;YAMAGUCHI ATSUSHI;MIYAKAWA HIDENORI;UEDA MIKIYA |
分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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