MEMS DEVICES WITH SUPPORT STRUCTURES AND METHODS OF THEIR PRODUCTION

摘要

FIELD: process engineering.SUBSTANCE: devices MEMS are produced as follows. Electrode layer is applied onto substrate.Temporary layer is applied on said electrode layer. Said temporary layer is perforated. Moving layer is applied on said temporary layer. Support structures are made above moving layer and, partially, in temporary layer perforation. Moving layer section extends between, at least, two support structures. Temporary layer is etched out to form cavity between moving layer and electrode layer.EFFECT: moving layer section may be deformed and pressed to underlying layers in response to electrostatic potential between moving and electrode layers.128 cl, 101 dwg