| 摘要 |
<p>A manufacture method for a surface mounted power LED support comprises steps: providing a wiring board (1) having both sided metal layers (11, 12); forming a hole (13); setting a metal layer (131) in the surface of the hole; thickening the metal layer (11, 12) of the wiring board; etching the metal layer of the wiring board; cutting the wiring board to form single support unit. A surface mounted power LED support comprises a both sided wiring board (10, 11, 12), a hole (13) formed in the wiring board and wiring layers (16, 17) set on the surface of the wiring board. The invention can increase the heat dissipation effect of the chip.</p> |
