| 摘要 |
PURPOSE: A PCB(Printed Circuit Board) and manufacturing method thereof are provided to promote process efficiency by etching a path for connecting a circuit between insulation layers. CONSTITUTION: A device chip package(100) includes a PCB and a device chip(200) mounted on the PCB. The PCB includes a first, a second, a third, and a fourth layer(120,150,176,186), a plurality of paths which pass through insulation layers, and a cover-layer(195) which covers the path. The plurality of the insulation layers includes a first, a second, a third, and a fourth insulation layer. The second insulation layer is laminated on the first insulation layer. The third and the fourth insulation layer are laminated on the second insulation layer. The first or the fourth insulation layer includes epoxy insulation resin which includes a low heat conduction rate. |
