THIN FILM PROCESS USING WAFER SUPPORT ADHESIVE FILM FOR PROCESSING IN SEMICONDUCTOR THIN FILM WAFER FABRICATION,申请号KR20090073680-传众专利搜索

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发明名称	THIN FILM PROCESS USING WAFER SUPPORT ADHESIVE FILM FOR PROCESSING IN SEMICONDUCTOR THIN FILM WAFER FABRICATION
摘要
申请公布号	KR101199487(B1)	申请公布日期	2012.11.09
申请号	KR20090073680	申请日期	2009.08.11
申请人		发明人
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
主权项
地址

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