发明名称 |
Through wafer vias and method of making same |
摘要 |
A method of forming and structure for through wafer vias and signal transmission lines formed of through wafer vias. The method of forming through wafer vias includes forming an array of through wafer vias comprising at least one electrically conductive through wafer via and at least one electrically non-conductive through wafer via through a semiconductor substrate having a top surface and an opposite bottom surface, each through wafer via of the array of through wafer vias extending from the top surface of the substrate to the bottom surface of the substrate. |
申请公布号 |
US8299566(B2) |
申请公布日期 |
2012.10.30 |
申请号 |
US20080188236 |
申请日期 |
2008.08.08 |
申请人 |
DING HANYI;JOSEPH ALVIN JOSE;STAMPER ANTHONY KENDALL;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DING HANYI;JOSEPH ALVIN JOSE;STAMPER ANTHONY KENDALL |
分类号 |
H01L23/48;H01L21/763 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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