发明名称 |
SOLID-STATE IMAGING DEVICE AND METHOD FOR MANUFACTURING THE SAME |
摘要 |
A solid-state imaging device and a method for manufacturing the same are provided. The solid-state imaging device includes a structure that provides a high sensitivity and high resolution without variations in spectral sensitivity and without halation of colors, and prevents light from penetrating into an adjacent pixel portion. A plurality of photodiodes are formed inside a semiconductor substrate. A wiring layer includes a laminated structure of an insulating film and a wire and is formed on the semiconductor substrate. A plurality of color filters are formed individually in a manner corresponding to the plurality of photodiodes above the wiring layer. A planarized film and a microlens are sequentially laminated on each of the color filters. In the solid-state imaging device, each of the color filters has an refraction index higher than that of the planarized film and has, in a Z-axis direction, an upper surface in a concave shape. |
申请公布号 |
US2012267743(A1) |
申请公布日期 |
2012.10.25 |
申请号 |
US201213448658 |
申请日期 |
2012.04.17 |
申请人 |
NAKAMURA TETSUYA;KATSUNO MOTONARI;TAKASE MASAYUKI;KATAOKA MASAO;PANASONIC CORPORATION |
发明人 |
NAKAMURA TETSUYA;KATSUNO MOTONARI;TAKASE MASAYUKI;KATAOKA MASAO |
分类号 |
H01L27/146;H01L31/0232;H01L31/18 |
主分类号 |
H01L27/146 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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