| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit board capable of narrowing a pitch interval of an electrode pad, and to provide a manufacturing method of an electronic device. <P>SOLUTION: A manufacturing method of a circuit board comprises: a step of forming a first layer 11 in which a first electrode 18 which is formed on a surface of a support substrate 30 and to which an electronic part terminal is connected is embedded; a step of polishing the first layer 11 so as to expose a surface of the first electrode 18; a step of forming a first wiring 12 connected to the first electrode 18 on the surface of the first layer 11 after exposing the surface of the first electrode 18; and a step of exposing a rear surface of the first electrode 18 by removing the support substrate 30 after forming the first wiring 12. <P>COPYRIGHT: (C)2013,JPO&INPIT |
