| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a copper foil for a printed wiring board, along with a laminate using it, capable of manufacturing a circuit having a cross section shape whose skirt is small at a good manufacturing efficiency, being suitable for finer pitches. <P>SOLUTION: The copper foil for a printed wiring board includes a copper foil base material, and a covering layer which covers at least a part of the surface of the copper foil base material. The covering layer comprises a first layer containing at least one kind selected from among Pt, Pd, and Au, and a second layer made from the metal of at least one kind selected from among Ni, Co, Sn, Zn, Cu, and Cr, being stacked sequentially from the surface of the copper foil base material. The thickness of the covering layer is 3-25nm. G≤F, f(F)≥1%, g(G)≥1%, where f(x) is atomic concentration (%) of at least one kind selected from among Pt, Pd, and Au, g(x) is atomic concentration of the metal of at least one kind selected from among Ni, Co, Sn, Zn, Cu, and Cr, and a first maximum value of the f(x) and the g(x) in section [0, 15] is assumed as f(F) and g(G). <P>COPYRIGHT: (C)2013,JPO&INPIT |
