CURING AGENT COMPOSITION FOR EPOXY RESIN AND THERMOSETTING MOLDING MATERIAL

摘要

The present invention relates in part to a curing agent composition for an epoxy resin, the composition being characterized in containing a novolac-type phenolic resin having a weight-average molecular weight (Mw) of 320-370 and having a dispersion degree [weight-average molecular weight (Mw)/number-average molecular weight (Mn)] of 1.02-1.05. The present invention can provide a curing agent composition for an epoxy resin having low melt viscosity and favorable blocking resistance, as well as a thermosetting molding material having superior heat resistance.