METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, RESIN SEALING DEVICE, AND SEMICONDUCTOR DEVICE

摘要

The present invention prevents seal glass from breaking by being pressed and made to warp by a release film in a portion where a cavity is present under the seal glass when the release film is used for molding a resin sealing package in order to prevent flash on the seal glass surface. A recess corresponding to the extent of compression by the release film is created on the die or the seal glass above the portion in which a hollow is present under the seal glass, whereby the pressure from the release film is relieved and the glass is prevented from breaking.