发明名称 |
CONDUCTIVE PARTICULATE, AND ANISOTROPIC CONDUCTIVE MATERIAL USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive particulate which enables the formation of an adequate indentation and allows a good connecting condition to be kept when electrically connecting an object to be connected while being a fine conductive particulate. <P>SOLUTION: The conductive particulate comprises: a base material composed of a resin particle; and at least one conductive metal layer formed on the surface of the base material. The resin particle has an average particle size of 1.0-2.5 μm. The compression modulus (10% K value) when the diameter of the resin particle is displaced by 10% is 10,000 N/mm<SP POS="POST">2</SP>or larger. The load value (breaking point load) when the resin particle is broken, and the average particle size of the resin particle satisfy the following expression: Breaking point load (mN)/Average particle size (μm)≥4. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2012190560(A) |
申请公布日期 |
2012.10.04 |
申请号 |
JP20110050784 |
申请日期 |
2011.03.08 |
申请人 |
NIPPON SHOKUBAI CO LTD |
发明人 |
MATSUMOTO KAZUAKI;KOBAYASHI NAOKI;SASAKI YOSHIKUNI |
分类号 |
H01B5/00;B22F1/02;H01B1/00;H01B1/22;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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