| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition for a semiconductor that enables an adhesive layer which bonds semiconductor elements to each other or a semiconductor element to a support member for mounting the semiconductor element to be formed thinner while satisfactorily retaining adhesive quality, and to provide a method for manufacturing a semiconductor device and a semiconductor device using the composition. <P>SOLUTION: The adhesive composition for a semiconductor includes (A) a cationic polymerizable compound, (B) a thermal cation generator, (C) a radical polymerizable compound, and (D) a photoradical generator. The composition has a viscosity at 25°C of 10-10,000 mPa s and a solvent content of ≤5 mass%. <P>COPYRIGHT: (C)2013,JPO&INPIT |
