BASE FILM AND PRESSURE-SENSITIVE ADHESIVE SHEET PROVIDED THEREWITH
摘要
[Problem] To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground. [Solution] This base film for a pressure-sensitive adhesive sheet bonded to a semiconductor wafer comprises: (A) a layer obtained by using energy rays to cure a formulation containing a urethane (meth)acrylate oligomer and a thiol-group-containing compound; and (B) a layer comprising a thermoplastic resin.
申请公布号
WO2012128311(A1)
申请公布日期
2012.09.27
申请号
WO2012JP57304
申请日期
2012.03.22
申请人
LINTEC CORPORATION;ARAKAWA CHEMICAL INDUSTRIES, LTD.;TAMURA, KAZUYUKI;AKUTSU, TAKASHI;ETO, YUKI;HUKUZAKI, TOMOHIDE