发明名称 |
Pick-Up Method of Die Bonder and Die Bonder |
摘要 |
The present invention provides a die bonder capable of stripping a die without fail, or a highly reliable die bonder or pick-up method using the die bonder. When a die to be stripped out of plural dies (semiconductor chips) bonded to a dicing film is to be tossed and stripped from the dicing film, the dicing film corresponding to predetermined positions out of the peripheral portion of the die is tossed to form stripping start points and then, the dicing film corresponding to portions other than the above predetermined positions is tossed to strip the die from the dicing film. |
申请公布号 |
US2012244647(A1) |
申请公布日期 |
2012.09.27 |
申请号 |
US201113224366 |
申请日期 |
2011.09.02 |
申请人 |
OKAMOTO NAOKI;YAMAMOTO KEITA;HITACHI HIGH-TECH INSTRUMENTS CO., LTD. |
发明人 |
OKAMOTO NAOKI;YAMAMOTO KEITA |
分类号 |
H01L21/66;B32B37/00;B32B38/10 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|