| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an imaging element unit capable of dissipating heat generated from an imaging element with efficiency and enabling high definition imaging without increasing the size of an imaging device even when the performance of the imaging element is improved and the number of pixels of the imaging element is increased and thereby the scale of a driving circuit is enlarged. <P>SOLUTION: A solid-state imaging element unit has: a solid-state imaging element having an imaging surface located on one side in a thickness direction; a holding member having a fastening part that is adhered and fixed to a back face of the solid-state imaging element which is located on an opposite side to the imaging surface, and holds the whole of the solid-state imaging element unit, and further dissipating heat generated from the solid-state imaging element; and a multilayer printed board operating the solid-state imaging element. The solid-state imaging element and the multilayer printed board are arranged so as to sandwich the holding member. A space provided inside an outer shape of the solid-state imaging element and surrounded by a ridgeline shape of an end part of the holding member, a plate thickness of the holding member, and the back face of the solid-state imaging element and the multilayer printed board is used as a component mounting area. <P>COPYRIGHT: (C)2012,JPO&INPIT |
