发明名称 MOUNTING METHOD AND MOUNTING DEVICE
摘要 <p>A mounting method of sequentially mounting elements on a substrate includes a mounting process of mounting one element, which is taken out by a take-out part from an accommodating part in which the elements are accommodated, on a first contact region of the surface of the substrate where a liquid is coated. The method further includes a coating process of coating a liquid, by a coating part movably provided together with the take-out part, on a contact region of the surface of the substrate different from the first contact region when the one element is mounted on the first region.</p>
申请公布号 KR20120106876(A) 申请公布日期 2012.09.26
申请号 KR20127019761 申请日期 2010.12.24
申请人 TOKYO ELECTRON LIMITED 发明人 NAKAMURA MICHIKAZU;SUGIYAMA MASAHIKO;SHINOZAKI DAI;AKIYAMA NAOKI
分类号 H01L21/52;H05K13/04 主分类号 H01L21/52
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