VIAS BETWEEN CONDUCTIVE LAYERS TO IMPROVE RELIABILITY

摘要

PROBLEM TO BE SOLVED: To provide techniques for improving reliability of vias.

SOLUTION: Another semiconductor device includes a first layer (21) including a plurality of electrically conductive wires (12-20), and a second layer (33); and a plurality of non-functional via pads (34) are included in the second layer or between the first layer and the second layer. A plurality of dangling vias (40) are included within a specified area of the first layer. The dangling vias connect one or more of the wires in the first layer to a respective one of the via pads.

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