| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problem: A ceramic substrate tends to warp due to a large difference in the degree of contraction by burning between a conductor paste and green sheet after burning and hence dimensional accuracy becomes difficult to improve. <P>SOLUTION: A method for manufacturing circuit board includes: a substrate formation process S1 for burning green sheet to form a ceramic substrate; a catalyst patterning process S2 for drawing and forming a catalyst pattern from a liquid body containing plating catalyst; and a plating process S3 for plating the catalyst pattern. <P>COPYRIGHT: (C)2012,JPO&INPIT |
