| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus having laminated structure of a wafer which does not exert any adverse influence upon film forming accuracy and may resist high temperature. <P>SOLUTION: A wafer processing apparatus comprises a holder base 110 which holds a wafer 14 at an inner peripheral side, and boat poles 31a-31c each having a holder holding part HS holding an outer peripheral side of the holder base 110. An outer diameter dimension of the holder base 110 is made larger than an outer diameter dimension of the wafer 14, and the holder base 110 is removable from the holder holding parts HS. Therefore, it is not necessary to fix the holder base 110 and the boat poles 31a-31c by welding or the like, and the holder base 110 and the boat poles 31a-31c are formed by SiC or the like, thereby easily realizing laminated structure of the wafer which may resist high temperature. Furthermore, the wafer 14 can be separated from the boat poles 31a-31c by the holder base 110, thereby suppressing adverse influences from being exerted upon film forming accuracy. <P>COPYRIGHT: (C)2012,JPO&INPIT |
