| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-power and high-optical-output LED while remaining the productivity and low cost feature of chip LEDs. <P>SOLUTION: In a chip LED on which at least one or more semiconductor chips are mounted, at least one of the semiconductor chips is a light-emitting element. A recessed part is formed to a mounting substrate having a rear face metal layer on a rear face from the surface side toward the rear face side, and a metal layer is formed on a bottom surface and an inner wall surface of the recessed part. The light-emitting element is die-bonded to the metal layer formed on the bottom surface of the recessed part, and wire-bonded to a wiring pattern formed on the surface of the mounting substrate. The metal layer formed on the bottom surface of the recessed part is electrically conducted to the rear face metal layer formed on the rear face of the mounting substrate. The rear face metal layer configures a heat dissipation path for dissipating heat generated in the light-emitting element. <P>COPYRIGHT: (C)2012,JPO&INPIT |
