| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a composition for forming a conductive pattern, by using which a fine conductive pattern can be applied and drawn on a semiconductor substrate using a printing method such as an inkjet method and stamp method, a conductive circuit having stress resistance can be obtained by forming cross linking in the drawn circuit by a hardener included in the composition so that the composition is cured to be rubbery, and thereby a finer conductive circuit can be achieved and a highly reliable semiconductor circuit can be formed. <P>SOLUTION: A composition for forming a conductive pattern of the present invention is obtained by blending conductive fine particles having a maximum particle size of less than 1 μm with a silicone rubber composition containing a curable organopolysiloxane and a hardener. <P>COPYRIGHT: (C)2012,JPO&INPIT |
