| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate joining apparatus which joins a joint substrate to a base substrate without causing cracks on the joint substrate. <P>SOLUTION: Since a substrate joining apparatus 300 does not press an upper substrate 220 from above with a clamp, cracks due to the pressing are prevented from occurring on the upper substrate 220. However, a guide pin 310 is erected at an outer peripheral part of a lower substrate 210. Thus, the position of the upper substrate 220, which is to be joined to the lower substrate 210, is properly regulated and the lower substrate 210 and the upper substrate 220 are properly joined. <P>COPYRIGHT: (C)2012,JPO&INPIT |
