发明名称 APPARATUS FOR MENUFACTURING OF LIGHT EMITTING DEVICE PACKAGE AND MENUFACTURING METHOD THEREOF
摘要 PURPOSE: A light emitting device package and a method for manufacturing the same are provided to improve heat emission efficiency by discharging heat through the side and bottom of a metal base. CONSTITUTION: A metal base(13) is comprised of metal material including aluminum and copper. A lead frame(15) is installed at the upper side of the metal base. The lead frame is projected from the metal base to outside. A chip(11) is installed on the metal base. A bonding wire(17) electrically interlinks the lead frame and the chip. An insulator(16) is placed between the lead frame and the metal base. A loading unit is formed on a circuit board in order to mount the metal base. Filler is placed between the loading unit and the metal base.
申请公布号 KR20120093672(A) 申请公布日期 2012.08.23
申请号 KR20110013374 申请日期 2011.02.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, JAE WOOK;CHOI, SEUNG YOON
分类号 H01L33/64;H01L33/62 主分类号 H01L33/64
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