发明名称 |
APPARATUS FOR MENUFACTURING OF LIGHT EMITTING DEVICE PACKAGE AND MENUFACTURING METHOD THEREOF |
摘要 |
PURPOSE: A light emitting device package and a method for manufacturing the same are provided to improve heat emission efficiency by discharging heat through the side and bottom of a metal base. CONSTITUTION: A metal base(13) is comprised of metal material including aluminum and copper. A lead frame(15) is installed at the upper side of the metal base. The lead frame is projected from the metal base to outside. A chip(11) is installed on the metal base. A bonding wire(17) electrically interlinks the lead frame and the chip. An insulator(16) is placed between the lead frame and the metal base. A loading unit is formed on a circuit board in order to mount the metal base. Filler is placed between the loading unit and the metal base.
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申请公布号 |
KR20120093672(A) |
申请公布日期 |
2012.08.23 |
申请号 |
KR20110013374 |
申请日期 |
2011.02.15 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, JAE WOOK;CHOI, SEUNG YOON |
分类号 |
H01L33/64;H01L33/62 |
主分类号 |
H01L33/64 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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