PLATED THROUGH HOLE, PRINTED CIRCUIT BOARD (PCB) AND METHOD FOR MANUFACTURING PLATED THROUGH HOLE

摘要

Provided are a plated through hole, a printed circuit board (PCB), and a method for manufacturing the plated through hole. The plated through hole is encircled by a hole wall and comprises: at least two through hole parts, the hole walls of the at least two through hole parts having an electrically conductive metal layer; and at least one stepped part, each of the at least one stepped part being provided between two adjacent through hole parts and being connected with the two adjacent through hole parts, and the at least one stepped part being provided with an insulated hole wall. The design of the plated through hole having at least two conductive through hole parts insulated from each other enables higher wire outlet density and opposite side compression on the connector, thereby enhancing the signal transmission capacity. Additionally, the reduction of the thickness-to-diameter ratio of the through hole lowers the PCB manufacturing difficulty, improves the product reliability, and lessens the production cost.