| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer level light-emitting element package and a method of manufacturing the same. <P>SOLUTION: A wafer level light-emitting element package 100 may includes a polymer layer 30 which bonds a light-emitting structure 10 and a package substrate 50, and the polymer layer 30 and the package substrate 50 may include a plurality of via holes 40, 60. The method of manufacturing the wafer level light-emitting element package 100 may include a step for forming the polymer layer 30 on the light-emitting structure 10 and bonding the package substrate 50 onto the polymer layer 30 by applying heat and pressure, and a step for forming the plurality of via holes 40, 60 in the polymer layer 30 and the package substrate 50. <P>COPYRIGHT: (C)2012,JPO&INPIT |
